- Paste Type: Polymer Thick Film
- Application Method: Dispensing
- Substrate: PET / Polyimide / PC
- Metal: Ag
- Application: Simple Circuits
- Description: EP-600 two-part, silver-filled conductive epoxy is designed for component attachment, termination and other applications in hybrid circuits, membrane keypads and other electromechanical assemblies. EP-600 exhibits quick break-off after dispensing and will not cause shorts from stringing in high-speed automated production processes.
- Key features: #Low Temperature Cure#Thixotropic properties, low viscosity & non-stringing characteristics make it ideal for high-speed dot-dispense processes which can run up to 70% faster#Exhibits outstanding adhesion to most metal & plastic substrates#Excellent temperature resistance & toughness allows for differences in coefficients of thermal expansion between bonded substrates#Lateral component push-off testing on print-treated mylar substrates show EP-600 to have 30 to 40% greater bond strength than other conductive epoxy adhesives#Convenient mix ratios and packaging are available. Options include 5-gram pre-weighed & sealed plastic CC-Packs and multiple bulk package configurations.
- Viscosity: 10-30 kcps. Brookfield DV-III Ultra, 25°C SC4-14 spindle @ SR 10
- Conductivity: <1.0 X 10-3 ?/cm
- Solids: 1
- Particle Size Distribution: <50 µ
- Resistivity (Ohm/sq.): <1.0 X 10-3 ?/cm